| Small surfaces and very thin films are increasingly important in the MEMS, semiconductor and photovoltaic industries. Comparably complex are the requirements for appropriate surface measurement technologies. Additionally, more and more companies seek for cost-effective entry level optical metrology systems. With its comprehensive line of surface metrology systems, Fries Research & Technology (FRT) offers solutions for both challenges. At this year's Semicon Europa 2008, the company presents two measurement systems out of its product portfolio, that are especially suited for the measurement of wafers in the MEMS, semiconductor, and photovoltaic industries: The affordable MicroSpy Topo and the very sophisticated high-class MicroProf-Series MFE and TTV.
FRT presents its products in hall 1, booth 145 at this year's Semicon Europa in Stuttgart.
Multisensor Technology from FRT
Multisensor Technology allows the customer to use multiple measuring principles in one upgradeable and extendible measuring system. This leads to increased versatility, productivity, reduces the need for multiple single-purpose instruments and eventually yields to a better price/performance ratio, not to speak of the virtually unlimited number of individual sensor configurations in the nanometer and micrometer measurement range. FRT's Multisensor approach is the ultimate technology base for applications in the MEMS, semiconductor and photovoltaic industries. It is used for spot checks as well as fully automated 100% control of films, structures and roughness on wafers to ensure process quality and yield. With its high-end MicroProf MFE and TTV systems, FRT can offer Multisensor solutions for the most challenging measuring tasks in today's high-tech industries.
The MicroProf MFE is a fully automated system for the entire host of 2D and 3D wafer metrology in the frontend section of semiconductor and MEMS production. Due to the industry proven modular technology it can deal with multiple wafer sizes and virtually every surface and material throughout the entire production process without having to change the hardware configuration. This saves floor space and offers superior total cost of ownership.
The systems can be configured to measure film thicknesses of optical transparent photoresists and opaque dielectric films, 2D profiles and 3D topographies such as rails and bumps with steep slopes up to 70°, surface roughness as well as Bow, Warp and Flatness. Additionally, FRT offers it's TTV technology to measure the total thickness variation of wafers to ensure process quality during polishing, lithography or etching of both patterned and unpatterned wafers. All measurements are ultra precise which means they are highly repeatable and matchable across multiple inspection tools. The systems are controllable via custom recipes that may be triggered manually by the operator or automatically via a SECS/GEM host. Class-1 clean room Enclosure Technology with EFEM capability and cassette to cassette handling ensure the lowest possible contamination and the highest measuring speed in this class of wafer inspection tools.
According to Henrik Leskinen, Manager Equipment Control of the MEMS manufacturer VTI Technologies "...the FRT system turned out to be the most suitable choice for monitoring our process parameters. Due to its flexible sensor-integration concept and automation capabilities we are able to conduct measurements both on entire wafers with regard to TTV as well as local high-resolution measurements."
MicroSpy Topo: The powerful, yet cost efficient entry level system
The confocal microscope MicroSpy Topo is FRT's entry level, table top measuring tool. It is intended for the measurement of roughness, contour and topography on small and light specimen in R&D. In 2008 the MicroSpy Topo was awarded with the German Industry Award for its innovative design.
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