The MicroProf® TTV quickly and simultaneously measures both sides of a part for thickness and total thickness variation (TTV) as well as for roughness, profile and topography on both surfaces. This is achieved by two opposing sensors, which are situated above and below an open frame, raster x-y stage.
Exchangeable part holders can be used to measure different samples such as wafers, dies, optics, foils, sheet metal, etc. Equipped with pattern recognition software, the MicroProf® TTV can be fully automated with measuring sequences and part handling. |